IGBT Stakpak Press-packs

  • Revolutionary press-pack design guarantees uniform chip pressure, even in long stacks.
  • Allows redundancy.
  • Modular sub-assemblies allow range expansion (higher voltages planned).
  • Designed for very high SOA (Safe Operating Area).
  • Low conduction and switching losses.
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Item #

Data Sheet

VCES

IC

Configuration

VCEsat(V) typ. 125°C

VF(V) typ. 125°C

IGBT-to-diode ratio

Housing

5SNA 1300K450300

5SNA 1300K450300.pdf

4500 V

1300 A

N/A

3.4

2.3

1:1

K

5SNA 2000K450300

5SNA 2000K450300.pdf

4500 V

2000 A

N/A

3.4

2.4

1:1

K

5SNA 2000K451300

5SNA 2000K451300.pdf

4500 V

2000 A

N/A

3.5

3.0

2:1

K

5SNR 10H2501

5SNR 10H2501.pdf

2500 V

1000 A

N/A

2.7

1.9

2:1

H

5SNR 13H2501

5SNR 13H2501.pdf

2500 V

1300 A

N/A

2.7

1.9

2:1

H

5SNR 20H2501

5SNR 20H2501.pdf

2500 V

2000 A

N/A

2.7

1.9

2:1

H